Our Facilities

Pulsed Laser Deposition (PLD)

Our lab is equipped with two chambers, and we use them for different purposes:

a) General purpose, where it is possible to deposit a wide variety of chalcogenides, even transition metal di-chalcogenides
b) Metal oxides such as ZnO, In2O3, Ga2O3, IGZO, HfO2, ITO, AZO, Al2O3, TiO2, among others.

The system is available with a 248nm KrF excimer laser, where the frequency of the shoots can be changed from 0.1 Hz to 25 Hz. The Lenses system allow us to change the energy density from 0.1 J/cm2 to 2 J/cm2. It is possible to deposit up to 3” substrate from RT to 850 °C. The maximum number of targets allows at the same time is 6 of 1” of diameter and up to 3 with 2” of diameter.

 

Pulsed Electron Deposition (PED)

PED is a process in which a pulsed (100ns) high power electron beam (approximately 1000 Å, 15 keV) penetrates approximately 1 μm into the target resulting in a rapid evaporation of target material, and its transformation in plasma state. The non-equilibrium extraction of the target material (ablation) facilitates stoichiometric composition of the plasma. Under optimum conditions, the target stoichiometry is thus preserved in the deposited film. All solid state materials-metals, semiconductors and insulators, can be deposited as thin films with PED. Unlike PLD where the ablation process is critically dependent on the optical absorption coefficient of the target material, in PED, the ablation depends only on the range of electrons in the target.

 

ATC Orion-8

The ATC Orion-8 sputter deposition system, by AJA International, has the capability to co-sputter conductive and insulating materials on substrates up to 4″ in diameter. In addition to Ar sputtering, O2 is also available for use in reactive-ion sputtering. The tool is equipped with 2 RF (300W) and 1 DC (750W) magnetron sources. The substrate is capable of heating to 850C while under rotation as well as exposure to reactive gas and RF bias (50W). A cooled chevron prevents sputtered material from entering into the turbopump. Software for control is also available for automated film stack deposition.

 

Closed Space Sublimation (CSS)

The OTF-1200X-RTP-II is a two heating zone rapid thermal processing vertical tube furnace with 11″ I.D. processing quartz tube and vacuum flange. It is designed for PVD or CSS (Close Spaced Sublimation) film coating up to 3″ diameter or 2″x2″square. The furnace is heated by two group halogen heaters (Top and Bottom) separately with max. 20ºC/s heating rate. Two 30 segment precision temperature controllers are built in with +/-1ºC accuracy. RS485 port and control software are included to allow for operation of furnace and monitoring temperature profile via PC.

Hall system and CCR

The Lake Shore 8400 Series can be used with both DC and AC field Hall measurement methodologies to facilitate the broadest range of research applications. The system includes fully integrated instrumentation, a magnet and power supply, plus software that dramatically helps you increase your research productivity and provides results that you can trust. The system is capable of DC field measurements and has a resistance range from 0.5 mΩ to 200GΩ. Measure Hall voltage, Hall coefficient, Hall mobility, and resistivity. For temperature-dependent applications, the 8400 Series options enable you to measure samples from 10 K to 350 K with a closed-cycle refrigerator or take dedicated 77 K measurements with an optional single-point LN2 body.

Solar Cell Characterization

For solar cell characterization we use a solar light source from Newport (67005 Arc Lamp Housing), with its power source model 69907. These 67005 Arc Lamp Housing was designed for 50 to 500 Watt Hg, Xe and Hg(Xe) DC arc lamps. It uses a F/1 Single Element Fused Silica condenser for a 1.3 inch (33 mm) diameter collimated beam at the 1.5 Inch Series output flange. For electrical measurement we use a Keithley 2400 Source Measure Unit (SMU). This instrument is designed specifically for test applications that demand tightly coupled sourcing and measurement and can measure up to 200V, 1A and 20W.The power source characteristics include low noise, precision, and readback. These instruments can act as a voltage source, a current source, a voltage meter, a current meter, and an ohmmeter.

Electrical Characterization

For electrical characterization of materials, we use Keithley 4200-SCS, this tool is a modular, fully integrated parameter analyzer that performs electrical characterization of materials, semiconductor devices and processes. From basic I-V and C-V measurement sweeps to advanced ultra-fast pulsed I-V, waveform capture, and transient I-V measurements, the 4200-SCS provides the researcher or engineer with critical parameters needed for design, development or production. For C-V measurement, HP 4284A precision LCR meter is used. The wide 20 Hz to 1 MHz test frequency range and superior test-signal performance allow the HP 4284A to test components to the most commonly-used test standards. These tools are complemented with a Cascade Microtech probe station, with a Temptronics heated chuck which range from -25°C to 250°C to perform measurements at different samples temperatures.

Omnijet 100 Inkjet Printer, manufactured by Unijet (S. Korea)

Inkjet printing is considered one of the most popular methods for solution-based deposition and noncontact patterning of organic materials. The popularity of this method lies in its cost-effectiveness and large-areas compatibility compared with other deposition techniques that require high temperature and vacuum system. Inkjet printing minimizes wastage of materials when fabricating devices; in most cases, the volume of material that is needed is in the range of a few picoliters (pL).

Features:

  • Four Refillable and cleanable cartridges (6 ml) in one head module.
  • FujiFilm Dimatix and Samsung cartridge can be used.
  • Six automatic Motion stages with ± 7 ㎛ Stage accuracy.
  • Auto Alignment with automatic head rotation.
  • Single Droplet Measurement.
  • XY Servo Motor Stage, ± 5 ㎛ Repeatability.
  • 300 x 210 mm effective stroke.
  • Automatic Head & Work Holder Rotation.
  • Heating substrate (20-150 °C).

Soldering Station

Our soldering station is composed of two main systems, the first one is a Soldering/Desoldering Station LF-8800, a versatile tool able to transfer temperatures from 300 to 896°F to its three components (Solder Iron, Tweezers and Hot-Air Pencil), and the second one is a SMD Rework Station LF-852D able to transferring heat from 212 to 896 °F through an air flow (1.5L-40L/Min.) for mounting or dismounting electrical components.
Both with high accuracy for those kind of simple/complex works that need high precision like Surface-mount device (SMD) in which the components are mounted or placed directly onto the surface of printed circuit boards (PCBs). Being the Soldering Station the last step (assembly) of our manufacturing process of electronic devices, complemented by design/simulation/fabrication at laboratory-level of electronic components (transistors, diodes and capacitors) and design/simulation/fabrication of electronic boards.

Gloveboxes

Our Gloveboxes provide a clean, low-humidity, Oxygen free environment for laboratory, cleanroom, electronic assembly and other critical processing operations in such industries as semiconductor manufacturing. These Gloveboxes set up for Positive pressure operations and when utilized with automatic purge control units, they can maintain a preset relative humidity or oxygen level using an inert gas such as Nitrogen.

Hoods

Our hoods protect the user from harmful or toxic fumes or vapors generated from a broad range of applications.

DXR Raman Microscope

Lateral resolution (xy) up to 1 µm and depth resolution up to 2 µm, a spectral range from below 100 to 3600 cm-1 with a spectral resolution up to 2 cm-1 one excitation lasers (532nm)