Quantum Connect

Welcome to the website for Quantum Connect, a new opportunity funded through NSF’s ExpandQISE program! If you are interested in more details, please read below. Further information can be obtained by contacting Prof. Kolodrubetz (mkolodru@utdallas.edu) or Prof. Henderson (rmh072000@utdallas.edu).

About Quantum Connect

Students will be selected and awarded a grant to attend the IEEE Quantum Week conference in Bellevue, WA from September 16-19, 2023. During the conference, students will (1) attend selected high-level talks including an introductory session on quantum science on Sunday, September 17; (2) participate in social and career development activities aimed at students; and (3) interact with members of the quantum industrial workforce including a career fair Monday, September 18.

Quantum Connect participants will share their IEEE Quantum Week experience with a “Through My Eyes” multimedia presentation at the program wrap-up meeting, to be held after the conference.

Eligibility

Undergraduate junior or senior level students, first year graduate students, or other students with experience or interest in STEM fields, including engineering, computer science, physics, math, etc. Candidates must be at least 18 years old as of September 15, 2023. Members of under-represented groups are strongly encouraged to apply. There are no citizenship requirements.

How to apply

Please go to https://forms.gle/PHqT3hKzS1NNPDaw6 to apply. The application deadline is August 10, 2023.

After you submit the form, you will be contacted by one of the Quantum Connect organizers to provide (a) an unofficial transcript, and (b) a 0.5-1 page written statement with your photo. This information should be sent to quantum.connect.2023@gmail.com. The organizers will also send an email to the person you identify as your reference to confirm their support for your application. 

Completed applications will be reviewed for participation after the deadline. This deadline may be extended depending on the number of applications.