Prof. Li was born and raised in China. After undergrad studies in Mechanical design and manufacturing at the University of Electronic Science and Technology of China(UESTC), he completed a Ph.D. in Mechanical Engineering at Missouri University of Science and Technology in 2018. From 2018 to 2019 he was a Postdoctoral Researcher at University of California-Davis. Since August 2019, he is currently at UT Dallas as an Assistant Professor.

APPOINTMENTS AND AFFILIATIONS

2019 - Assistant Professor of Mechanical Engineering

CONTACT INFORMATION

Office Location: ECSW 4.355C, 904 Franklyn Jenifer Dr, Richardson, TX 75080

Office Phone: (972)-883-3983

Email Address: Wei.Li@UTDallas.edu

RESEARCH INTERESTS

--> Metal Additive Manufacturing 
--> Bio 3D printing 
--> Remanufacturing with AM process
--> Fabrication and characterization of customized alloy with multi-materials

COURSES TAUGHT

MECH 6V49 Additive Manufacturing
MECH 3381 Introduction to Manufacturing Processes
MECH 3V95 Introduction to Additive Manufacturing

RECENT PUBLICATIONS

Wei Li, Dong Qian, Kishore Mysore Nagaraja, Cheng Sun,
Modeling study of porosity’s effect on grain evolution during directed energy deposition,
Materials Letters,
Volume 307,
2022.

Wei Li, Kishore Mysore Nagaraja, Xinchang Zhang, Ran Zhou, Dong Qian, Hongbing Lu,
Multi-physics modeling of powder bed fusion process and thermal stress near porosity,
Manufacturing Letters,
2021.

Xinchang Zhang, Lan Li, Tan Pan, Yitao Chen, Yunlu Zhang, Wei Li, Frank Liou,
Additive manufacturing of copper-tool steel dissimilar joining: Experimental characterization and thermal modeling,
Materials Characterization,
Volume 170,
2020,

Cui, Wenyuan, Wei Li, Wei-Ting Chen, and Frank Liou. 2020. “Laser Metal Deposition of an AlCoCrFeNiTi_0.5 High-Entropy Alloy Coating on a Ti6Al4V Substrate: Microstructure and Oxidation Behavior” Crystals 10, no. 8: 638.

Li, L., Zhang, X., Cui, W. et al. Temperature and residual stress distribution of FGM parts by DED process: modeling and experimental validation. Int J Adv Manuf Technol 109, 451–462 (2020).

For More Publications: GOOGLE SCHOLAR